LMZ31503 Datasheet | Texas Instruments

Features - 1 plete Integrated Power Solution Allows Small Footprint, Low-Profile Design - 9 mm × 15mm × 2.8mm package - Pin patible with LMZ31506 - Efficiencies Up To 95% - Wide-Output Voltage Adjust 0.8 V to 5.5 V, with 1% Reference Accuracy - Optional Split Power Rail Allows Input Voltage Down to 1.6 V - Adjustable Switching Frequency (330 k Hz to 780 k Hz) - Synchronizes to an External Clock - Adjustable Slow-Start - Output Voltage Sequencing / Tracking - Power Good Output - Programmable Undervoltage Lockout (UVLO) - Overcurrent Protection (Hiccup-Mode) - Over Temperature Protection - Pre-bias Output Start-up - Operating Temperature Range: - 40°C to +85°C - Enhanced Thermal Performance: 13°C/W - Meets EN55022 Class B Emissions - Integrated Shielded Inductor - Create a Custom Design Using the LMZ31503 With the WEBENCH® Power Designer 3 Description The LMZ31503 power module is an easy-to-use integrated power solution that bines a 3-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external ponents and eliminates the loop pensation and magnetics design process. The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a pact point-of-load design with up to 95% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 3-A rated output current at 85°C ambient temperature without airflow. The LMZ31503 offers the flexibility and the featureset of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution patible with standard QFN mounting and testing techniques. Simplified Schematic VIN CIN LMZ31503 PVIN PWRGD VIN VOUT SENSE+ VOUT COUT 2 Applications - Broadband & munications Infrastructure - Automated Test and Medical Equipment - pact PCI / PCI Express / PXI Express - DSP...